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Intel, TSMC & Samsung On 450mm Wafers In 2012
Intel, TSMC & Samsung on 450mm Wafers in 2012
Written by Visionary and filed under News > Technology
Published on May 6, 2008, 8:09 am
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Intel, Samsung and TSMC today announced they have reached agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012.. The total silicon surface area of a 450mm wafer and the number of printed die is more than twice that of a 300mm wafer. The bigger wafers help lower the production cost per chip. Read More >>