OCZ Technology, the brand name built on overclocking and hardware enthusiasts, had a great show at CEBIT 2007, showcasing a bunch of innovative and unique items, such as the Gaming Brainwave Actuator and it's air-water Hybrid Cooler with a carbon graphite base. Today unfortunately, instead of these interesting items, we are reviewing something more common... the main bulk of OCZ's business - System Memory in the form of OCZ Reaper HPC Edition: PC9200 with CAS Latency 5-5-5. That is a rated speed of 1150MHz, and they come with OCZ's Heatpipe Cooling solution integrated into their heatspreaders. The Reaper HPC is an innovative cooling solution developed by OCZ to effectively minimize performance-robbing heat. Heat meets its death as it rises into thermo-conductive copper heat pipe conduit and is dissipated through an ultra-compact aluminum fin array. By guiding heat away from key memory components, the unique Reaper HPC design helps facilitate improved over clocking performance, while improving longevity and stability of the modules - so it's claimed.

Black Heatspreaders transfer heat to the copper heatpipes which pass the heat over to a slab of Aluminum heatsink which slowly dissipates heat to the PC Case's ambient air. Of course the more the airflow over this slab, the faster the dissipation should occur.

The slab of Aluminum heatsink as the final component heat is delivered to

If you have a chance to scrutinize, you will find that the heatspreaders are very closely bonded onto the BGA RAM chips, unlike the more common scenario of a thick thermal tape/pad in-between RAM chips and metal.